A sputtering target chinhu chemagetsi chinoumba firimu rakatetepa nekubatanidza chinhu chakaita sealloy kana metal oxide kune yemagetsi substrate paatomu.Pakati pavo, iyo sputtering target yefirimu inosviba inoshandiswa kugadzira firimu pane organic EL kana liquid crystal panel kusviba wiring uye kuderedza kuoneka kwechiedza kupenya (kuderera kutaridzika) kweTFT wiring.Iyo sputter target ine zvinotevera zvakanakira nemhedzisiro.Kana ichienzaniswa neyakapfuura zvigadzirwa, inobatsira kuvandudza yakakwira dhigirii yehunyoro uye dhizaini rusununguko rwekuratidzwa kwakasiyana, uye kuderedza ruzha runokonzerwa neiyo wiring inotaridza mwenje we semiconductor zvinoenderana zvigadzirwa.
Zvakanakira uye mhedzisiro yealuminium chinangwa:
(1) Mushure mekunge chinangwa chealuminium chaumbwa pane wiring, chiedza chinooneka chinogona kuderedzwa
kana ichienzaniswa neyakapfuura zvigadzirwa, inogona kuwana yakaderera kuratidza.
(2) DC sputtering inogona kuitwa pasina reactive gasi
kana zvichienzaniswa nezvigadzirwa zvekare, zvinobatsira kuona iyo firimu homogeneity yema substrates makuru.
(3) Mushure mekunge firimu raumbwa, iyo etching process inogona kuitwa pamwe chete neiyo wiring
gadzirisa zvinhu zvinoenderana neiyo iripo etching maitiro emutengi, uye inogona kubatanidza pamwe neiyo wiring pasina kushandura iripo maitiro.Pamusoro pezvo, kambani ichapawo rutsigiro zvinoenderana nemamiriro ekutuka evatengi.
(4) Yakanakisa kupisa kupisa, mvura uye alkali kuramba
kunze kwekudzivirira kwemvura uye alkali kushorwa, inewo yakanyanya kupisa kupisa, saka maitiro emufirimu haashanduke muTFT wiring process process.
Nguva yekutumira: Aug-10-2022