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Molybdenum Copper

MoCu Sputtering Target High Purity Thin Firimu Pvd Coating Yakagadzirwa Yakagadzirwa Mufananidzo

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Category	Alloy Sputtering Target
Chemical Formula	MoCu
Composition	Molybdenum Copper
Kuchena	99.9%, 99.95%, 99.99%
Shape	Ndiro, Column Targets, arc cathodes, Tsika-yakagadzirwa
Production Process	PM
Saizi Inowanikwa	L≤200mm, W≤200mm

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Molybdenum Copper sputtering target inogadzirwa nenzira ye infiltration sintering: Molybdenum powders sintered uye inoumbwa kuita semi-finished products, yakasanganiswa neinozotevera microwave-assisted aqueous solution strategy.Molybdenum Copper alloy ine zvakatanhamara zvemuviri uye zvemagetsi zvimiro: inogutsa magetsi uye yekupisa conductivity, yakaderera uye inogadziriswa coefficient yekuwedzera kwekupisa, kupfeka kuramba, uye yakakwirira tembiricha simba.

Zvinyorwa (%)	Cu	Mo	Kusachena (%)
MoCu10	10±2	Balance	≤0.1
MoCu15	15±3	Balance	≤0.1
MoCu20	20±3	Balance	≤0.1
MoCu25	25±3	Balance	≤0.1
MoCu40	40±5	Balance	≤0.1

Rich Special Equipment inyanzvi muKugadzira Sputtering Target uye inogona kugadzira Molybdenum Copper Sputtering Materials zvinoenderana neVatengi 'mataurirwo.Kuti uwane mamwe mashoko, tapota taura nesu.

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